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Medical technology: volume production of optoelectronic polymer and glass modules
We can provide you with tailored and cost-effective optoelectronic products for your medical technology applications.

Thanks to our assembly and connection technology, we can rapidly integrate optical, electronic or mechanical components in polymer-based single or system components, which are tailored to your individual applications. The quality and performance of our products complies with DIN EN ISO 13485:2003, while we can also provide you with reliable and cost-effective volume production.
Benefits
- Powerful: our products meet the highest quality requirements
- Volume production: we offer cost-effective mass production of our polymer and glass modules
- Expertise: experience in the development and production of miniaturized modules
- Customer-specific: perfectly tailored to your application
- Highest quality standards: compliant with DIN EN ISO 13485:2003
Fields of Application
- Endoscopy: components and modules for minimally invasive methods
- Biotechnology: chip-based analysis systems
- Diagnostics and therapy: multi-parameter analytics and light therapy
- Health care/life science: skin scanning, LASIK, proteomics, biotech, patient monitoring
- Medical technology: analysis and diagnostics, endoscope heads, dental devices,disposable medical products, polymer optics for blood sugar meters, optical systems and units for dental scanners, POC (point-of-care) components and units; devices for skin type and hair color determination
Product preview
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Optoelectronic modules

From components to modules, we are your supplier for:
- Optical, mechanical and system design
- Prototypes
- Tool construction and production of customer specific injection molds
- Injection molding
- Micro injection molding
- 2-component injection molding
- Coating of optical components

From chip design to LED modules
- Customer specific chip layout
- LED chips in the spectral range 360 nm - 1750 nm
- High-speed chips, High-power chips, Point source chips,monolithic display chips
- Photodiodes with sensitivity 150 nm - 2600 nm
- Excellent signal-to-noise-ratio
- LED and photodiode modules for standard and custom designs
- Flexible production of small to medium production runs

From board to optical packaging
- Assembly of optoelectronic modules
- Wafer dicing
- Chip bonding
- Wire bonding (Gold and Aluminium)
- Filter assembly
- Potting
- COB, SMT, Flipchip and optical packaging
- Cleanroom class 100

Mass production of optoelectronic modules
- Fully and partially automated assembly processes
- Manual assembly
- Laser joining and laser welding
- Ultrasonic welding, bonding technologies
- Micro and compensation assembly
- Cleanroom class 100,000 and 10,000
- Traceability
- Quality management and assurance according to FDA recommendation
Product recommendations
Components
Please contact our experts for advice.
Polymer Optics & Optoelectronic Systems
+49 36482 45-406
+49 36482 45-226
Carl Wang
+86 021 38252380-102
Light & Optics | North America
+1 561 881 7400